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W25Q16JVSSIQ 详细资料

 FLASH存储器 > W25Q16JVSSIQ 华邦WINBOND

(与C131025为同一颗物料,只是编带方式不一样。)3V 16Mbit Serial Flash Memory with dual/quad SPI

W25Q16JVSSIQW25Q16JVSSIQ


W25Q16JVSSIQ--简介

The W25Q16JV (16M-bit) Serial Flash memory provides a storage solution for systems with limited space, pins and power. The 25Q series offers flexibility and performance well beyond ordinary Serial Flash devices.

They are ideal for code shadowing to RAM, executing code directly from Dual/Quad SPI (XIP) and storing voice, text and data. The device operates on a single 2.7V to 3.6V power supply with current consumption as low as 1μA for power-down.


W25Q16JVSSIQ--特性

New Family of SpiFlash Memories

– W25Q16JV: 16M-bit / 2M-byte (2,097,152)

– Standard SPI: CLK, /CS, DI, DO

– Dual SPI: CLK, /CS, IO0, IO1

– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3

Highest Performance Serial Flash

– 133MHz Single, Dual/Quad SPI clocks

– 266/532MHz equivalent Dual/Quad SPI

– 66MB/S continuous data transfer rate

– Min. 100K Program-Erase cycles per sector

– More than 20-year data retention

Efficient“Continuous Read”

– Continuous Read with 8/16/32/64-Byte Wrap

– As few as 8 clocks to address memory

– Allows true XIP (execute in place) operation

– Outperforms X16 Parallel Flash

Low Power, Wide Temperature Range

– Single 2.7V to 3.6V supply

– -40°C to +85°C operating range

– <1μA Power-down (typ.)

Flexible Architecture with 4KB sectors

– Uniform Sector/Block Erase (4K/32K/64K-Byte)

– Program 1 to 256 byte per programmable page

– Erase/Program Suspend & Resume

Advanced Security Features

– Software and Hardware Write-Protect

– Power Supply Lock-Down and

– Special OTP protection

– Top/Bottom, Complement array protection

– Individual Block/Sector array protection

– 64-Bit Unique ID for each device

– Discoverable Parameters (SFDP) Register

– 3X256-Bytes Security Registers with OTP locks

– Volatile & Non-volatile Status Register Bits

Space Efficient Packaging

– 8-pin SOIC 150-mil / 208-mil

– 8-pad USON 2X3mm/4x3-mm

– 8-pad XSON 4x4-mm

– 8-pad WSON 6x5-mm

– 8-ball WLCSP

– Contact Winbond for KGD and other options


W25Q16JVSSIQ--规格

  • 欧盟限制某些有害物质的使用
    Compliant 
  • ECCN (US)
    EAR99
  • Cell Type
    NOR
  • Chip Density (bit)
    16M
  • Architecture
    Sectored
  • Boot Block
    No
  • Block Organization
    Symmetrical
  • Address Bus Width (bit)
    1
  • Sector Size
    4Kbyte x 512
  • Page Size
    256byte
  • Programmability
    Yes
  • Timing Type
    Synchronous
  • Max. Access Time (ns)
    6
  • Maximum Erase Time (s)
    25/Chip
  • Maximum Programming Time (ms)
    3/Page
  • Interface Type
    Serial-SPI
  • Minimum Operating Supply Voltage (V)
    2.7
  • Typical Operating Supply Voltage (V)
    3|3.3
  • Maximum Operating Supply Voltage (V)
    3.6
  • Programming Voltage (V)
    2.7 to 3.6
  • Operating Current (mA)
    25
  • Program Current (mA)
    25
  • Minimum Operating Temperature (°C)
    -40
  • Maximum Operating Temperature (°C)
    85
  • Supplier Temperature Grade
    Industrial
  • Command Compatible
    Yes
  • ECC Support
    No
  • Erase Suspend/Resume Modes Support
    Yes
  • Simultaneous Read/Write Support
    No
  • Support of Common Flash Interface
    No
  • Support of Page Mode
    No
  • Minimum Endurance (Cycles)
    100000
  • Packaging
    Tube
  • Supplier Package
    SOIC
  • Standard Package Name
    SOP
  • Pin Count
    8
  • Mounting
    Surface Mount
  • Package Height
    1.8
  • Package Length
    5.28
  • Package Width
    5.28
  • PCB changed
    8
  • Lead Shape
    Gull-wing



W25Q16JVSSIQ数据资料下载:W25Q16JVSSIQ.PDF

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